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2019 IPC Southeast Asia High Reliability Conference Thailand

August 16, 2019 • The Grand Fourwings Convention Hotel • 333 Srinakarin Road Huamark, Bangkok, Thailand


Get practical methodologies that can be deployed today to enhance your operations

High Reliability is critical when electronics assemblies are working in harsh environments where there are high temperature difference, vibration; and components get smaller and demand for high reliability products increases. IPC has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia to discuss:

  • critical areas of the assembly process and
  • how design and materials choices will affect cost, reliability and turnaround time.

These important one-day events will focus on advanced research results, practical methodologies and standards in the automotive, aerospace and other electronic fields — critical information for engineers and managers responsible for reliability.

For more information, please contact: Raymond Foo, RaymondFoo@ipc.org; Henry Ton, HenryTon@ipc.org.

Time Topic Speaker
08:20–08:50 Conference Registration  
08:50–09:00 Welcome/Opening Address Raymond Foo, IPC Southeast Asia Representative
09:00–09:45 R&D of a Low Voiding Lead-free Solder Paste for High Reliability Applications Devendra Rao, Inventec Performance Chemicals SEA Sdn. Bhd.
09:45–10:30 Developing Cleaning Process Parameters TC Loy, Sales & Technical Manager, Kyzen Corporation
10:30–10:45 Coffee/Tea Break  
10:45–11:30 What Kind of Soldering Robot is Effective for Vertical Fill Soldering Tatsuya Hirosaki, Sales Manager, Apollo Seiko South Asia Co., Ltd
11:30–12:15 Characterization of Resin Rich Pockets in Die Attach Bondline Quek Rong Xuan, Technical Customer Service Engineer, Henkel Singapore Pte Ltd
12:15–13:30 Lunch  
13:30–14:15 Automotive Addenda to Industry-Wide Consensus-Based International Standards Douglas J. Sober, Director of Materials and IEC Engagement, IPC
14:15–15:00 Optimizing Fine Pitch Printing for Assembly of 0603 Components with Type 4 High Reliability Silver-free Lead-free Solder Paste Takatoshi Nishimura, Director & Regional Technical Manager, Nihon Superior Co., Ltd
15:00–15:20 Coffee/Tea Break  
15:20–16:00 IPC Standards & Training Program – Updates & Case Studies Johnson Stephen Muriel, Master IPC Trainer, IPC Southeast Asia
16:00–16:30 Conclusion/ Networking Session  

Gold Sponsors

Nihon Superior
Kyzen
Inventec
Henkel
Apollo