Questions? We’ll be your guide.
2019 IPC Southeast Asia High Reliability Conference Vietnam
August 14, 2019 • Eastin Grand Hotel Saigon • 253 Nguyen Van Troi St., Ho Chi Minh, Vietnam
Get practical methodologies that can be deployed today to enhance your operations
High Reliability is critical when electronics assemblies are working in harsh environments where there are high temperature difference, vibration; and components get smaller and demand for high reliability products increases. IPC has brought together an international panel of experts for this inaugural conference in the heart of Southeast Asia to discuss:
- critical areas of the assembly process and
- how design and materials choices will affect cost, reliability and turnaround time.
These important one-day events will focus on advanced research results, practical methodologies and standards in the automotive, aerospace and other electronic fields — critical information for engineers and managers responsible for reliability.
For more information, please contact: Raymond Foo, RaymondFoo@ipc.org; Henry Ton, HenryTon@ipc.org.
| Time | Topic | Speaker |
|---|---|---|
| 08:20–08:50 | Conference Registration | |
| 08:50–09:00 | Welcome/Opening Address | Raymond Foo, IPC Southeast Asia Representative |
| 09:00–09:45 | R&D of a Low Voiding Lead-free Solder Paste for High Reliability Applications | Steven Teh, Technical Manager, Inventec Performance Chemicals |
| 09:45–10:30 | Developing Cleaning Process Parameters | TC Loy, Sales & Technical Manager, Kyzen Corporation |
| 10:30–10:45 | Coffee/Tea Break | |
| 10:45–11:30 | What Kind of Soldering Robot is Effective for Vertical Fill Soldering | Tatsuya Hirosaki, Sales Manager, Apollo Seiko South Asia Co., Ltd |
| 11:30–12:15 | Characterization of Resin Rich Pockets in Die Attach Bondline | Quek Rong Xuan, Technical Customer Service Engineer, Henkel Singapore Pte Ltd |
| 12:15–13:30 | Lunch | |
| 13:30–14:15 | Automotive Addenda to Industry-Wide Consensus-Based International Standards | Douglas J. Sober, Director of Materials and IEC Engagement, IPC |
| 14:15–15:00 | Optimizing Fine Pitch Printing for Assembly of 0603 Components with Type 4 High Reliability Silver-free Lead-free Solder Paste | Takatoshi Nishimura, Director & Regional Technical Manager, Nihon Superior Co., Ltd |
| 15:00–15:20 | Coffee/Tea Break | |
| 15:20–16:00 | IPC Standards & Training Program – Updates & Case Studies | Johnson Stephen Muriel, Master IPC Trainer, IPC Southeast Asia |
| 16:00–16:30 | Conclusion/ Networking Session |
Gold Sponsors
